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Cutting device under packaging level For packaging workstations manufactured from the Würth aluminium profile system WAPS®
Cutting device under packaging level For packaging workstations manufactured from the Würth aluminium profile system WAPS<SUP>®</SUP> - 1
Cutting device under packaging level For packaging workstations manufactured from the Würth aluminium profile system WAPS<SUP>®</SUP> - 2

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Cutting device under packaging level For packaging workstations manufactured from the Würth aluminium profile system WAPS®

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  • Dispensing for films, paper etc.

  • Aluminium profile frame

  • Includes dispensing

  • Placed under table
NoticeAttaching a light not possible